november 2010 doc id 16078 rev 1 1/7 7 ESDARF03-1BF3 ultralow capacitance esd protection for antenna features ultralow diode capacitance 0.6 pf single line, protected against 15 kv esd breakdown voltage v br = 6.0 v min. flip chip 400 m pitch, lead-free very low leakage current very small pcb area rohs compliant benefits minimized impact on rise and fall times for maximum data integrity low pcb space occupation higher reliabilit y through monolit hic integration complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015.7: ? 25 kv (human body model) applications antenna protection dvb - h gps description the ESDARF03-1BF3 is a monolithic, application specific discrete device dedicated to esd protection of antennas. its ultralow line capacit ance secures a high level of signal integrity without compromising the protection of sensitive chips against the most stringently characterized esd strikes. figure 1. pin layout (bump side) figure 2. device configuration tm : ipad is a trademark of stmicroelectronics. flip chip (4 bumps) b 1 2 a a2 (gnd) a1 (rf in ) b2 (nc) b1 (nc) top view 50 line a1 a2 b2 b1 note: bumps b1 and b2 must be connected together on the pcb. www.st.com
characteristics ESDARF03-1BF3 2/7 doc id 16078 rev 1 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 15 8 kv p pp peak pulse power dissipation (8/20 s) 60 w t j maximum junction temperature 125 c t op operating temperature range -30 to + 85 c t stg storage temperature range -55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 9 v i rm v rm = 3 v 100 na r d exponential wave form 8/20 s, i pp = 1 to 5 a 2.6 ti r = 1 ma 5 10 -4 / c c line v line = 0 v, v osc = 30 mv, f = 1 mhz 0.6 0.8 pf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage t = voltage temperature coefficient v = line capacitance br rm rm rm cl r = dynamic impedance i = peak pulse current d pp f
ESDARF03-1BF3 characteristics doc id 16078 rev 1 3/7 figure 8. relative variation of leakage current versus junction temperature (typical values) figure 4. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 5. esd response to iec 61000-4-2 (-8 kv contact discharge) x: 20 ns/division y: 50 v/division x: 20 ns/division y: 50 v/division figure 6. junction capacitance versus frequency (typical values) figure 7. s21 attenuation measurement 0.0 0.1 0.2 0.3 0.4 0.5 0.6 1.e+07 1.e+08 1.e+09 c(pf) v osc =30 mv rms t j =25 c f(hz) db 10m 30m 100m 300m 1g 3g 10g -1 0 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 s21 f (hz) <0.1db <1ghz 0.15db 1.45ghz - 1.492ghz il frequency <0.1db <1ghz 0.15db 1.45ghz - 1.492ghz il frequency 1.e+00 1.e+01 1.e+02 25 40 55 70 85 100 115 i [t ] / i [t = 25 c] rj rj t (c) j v= 3v r i/o-i/o
ordering information scheme ESDARF03-1BF3 4/7 doc id 16078 rev 1 2 ordering information scheme figure 9. ordering information scheme esda rf 03 - 1 b f3 esd protection device application package rf antenna b = bi-directional f = flip chip 3 = lead-free, pitch = 400 m, bump = 255 m version number of lines directional
ESDARF03-1BF3 package information doc id 16078 rev 1 5/7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions figure 11. footprint recommendations figure 12. marking 0.82 mm 30 m 0.82 mm 30m 400 m 40 255 m 40 400 m 40 605 m 55 210 m 210 m 220 m recommended 220 m recommended 260 m maximum solder stencil opening : copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot xx = marking yww = datecode (y = year ww = week) z = manufacturing location
ordering information ESDARF03-1BF3 6/7 doc id 16078 rev 1 figure 13. flip chip tape and reel specifications note: more information is availa ble in the application notes: an2348: ?400 m flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? 4 ordering information 5 revision history user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.69 0.1 0.92 0.05 0.20 0.05 0.92 0.05 xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww dot identifying pin a1 location table 3. ordering information order code marking package weight base qty delivery mode ESDARF03-1BF3 r3 flip chip 0.91 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 15-nov-2010 1 initial release.
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